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Yield Forum Series

The Rudolph Yield Forum™ is a technology and applications seminar for semiconductor manufacturing professionals—fab managers, tool owners and process engineers. Launched in 2006, Yield Forums have been held in all major semiconductor manufacturing regions around the world. A typical agenda might include sessions for front-end wafer processing, back-end final manufacturing, probe card test and analysis and LED manufacturing. Speakers from top fabs join Rudolph applications experts to discuss industry trends and share current application data and results from ongoing tool evaluations and production processes at various fabs.

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2014 Yield Forum Schedule
15 April - Shanghai, China
31 July - Singapore
17 September - Regensburg, Germany

2013 Yield Forums
7 May - Hsinchu, Taiwan
6 December - Tokyo, Japan
10 December - Seoul, Korea

IMAPS Microelectronics

October 13 - 16, 2014

Town and Country Conference Center
San Diego, California, USA

Join Rudolph at booth #520 at the IMAPS 47th International Symposium on Microelectronics! Learn more about Rudolph’s product suite for the demanding requirements of the advanced packaging market, including 2D/3D bump inspection, RDL and overlay metrology, and a lithography stepper specifically designed for the back-end. Turn data into useful information with Rudolph’s proprietary software solutions including run-to-run control, fault detection and classification and yield management systems.

Stop by the following Speeches on Tuesday, October 14:

8:30am-Russ Dudley will present on the topic of Automated Metrology Improves Productivity and Yields for Wafer Level Packaging in High Volume Manufacturing

9:00am-Klaus Ruhmer will present on the topic of High Resolution Patterning Technology to enable Panel Based Advanced Packaging

2:00pm-James Webb will present on the topic of Comparison of Measured and Modeled Lithographic Process Capabilities for 2.5D and 3D Applications using a Step and Repeat Camera

Stop by the following Speech on Wednesday, October 15:

3:00pm-Richard Beaver will present on the topic of An Integrated FDC-centric Approach for Process Engineering in BEOL for Advanced Packaging - A Case Study in Die Singulation Process Optimization
 

Full conference program is available on the IMAPS website.

Semicon Europa

October 7-9, 2014

Alpexpo
Grenoble, France

Rudolph looks forward to co-exhibiting with Silicon-Saxony in Grenoble, France at Semicon Europa 2014. Plan to stop by booth #1032 and talk to one of our experts regarding your application needs. We look forward to meeting you!

Semicon Russia

May 14-15

Expocentre Moscow
Moscow, Russia

Join Rudolph at SEMICON Russia, your connection to the global Semiconductor, Microelectronics and Nanotechnology Industry Suppliers. 

Yield Forum China

A Technology and Applications Forum presented by Rudolph Technologies

15 April 2014  | 2014年4月15日
Shanghai, China |  上海瑞吉红塔大酒店
The Hongta Hotel, 889 Dongfang Rd, Pudong, Shanghai

Featuring guest speakers from local fabs, the Rudolph Yield Forum provides process engineers, fab managers and tool owners with new application data and process control techniques that address current process challenges.

Agenda Highlights | 研讨会日程介绍

General Session
The New Age of Semiconductors—Our Industry Growth Drivers
MEOL—BEOL Supply Chain Perspective on the 2.5D Packaging Landscape: A Survey of Advancements in Kiru (切る), Kezuru (削る), Migaku (磨く) Processing Technologies for TSV-Enabled Device Fabrication, DISCO guest speaker
Emergence of the Middle-End: Convergence of Front-End and Back-end

Wafer Processing (Front-end) Session | 前段芯片制造
TSV Middle Inspection and Metrology
Intro to SEM ADC
Advanced Macro Inspection for Single Wafer Yield Loss and Bubble Detection on BSI CMOS Image Sensors, XMC guest speaker
Metrology Challenges and Techniques for Gate Oxide Control at 1 and 2x Nodes
Supply Chain Value
Bare Wafer Inspection
Fleet Management: Optimizing your Rudolph Inspection Systems
Server-centric Productivity Solutions for Metrology
MEOL Lithography

Final Manufacturing (Back-end) Session | 后段封装和测试
Trends in Cu Pillar Bump Metrology and Yield Improvement Strategies
Fault Detection and Classification in Advanced Packaging
Lithography for Bumping, RDL, Fan-Out & Interposers
3D Measurement for TSV, MEOL, RST and Temporary Bonding
Fleet Management: Optimizing your Rudolph Inspection Systems
Metrology Techniques for Advanced Packaging Processes
Closed Loop Total Solution for Advanced Packaging Lithography
Monitoring Process Tool Particles & Edge Trip Defects using Darkfield Laser Scattering Technology 
A Comprehensive Solution for Post-saw Delamination including Reduced Review

**Topics subject to change

For More Information: 更多信息请联系:
Contact: 联系人:Wendy Wang, Rudolph China
Email: wendy.wang@rudolphtech.com
Tel: +86-21-60930600

Strategies in Light

February 12-14, 2013

Booth 932
Santa Clara Convention Center

Visit the Rudolph exhibit at SIL 2013 to learn about the manufacturing software making a difference to LED manufacturers—a suite of advanced analysis and control software systems that are designed to maximize ROI, allowing LED manufacturers to gain market share through lower ASP, increase profits through R&D investments, and enable new markets.

Matthew Chriss will present during the Manufacturing Track on Thursday, February 14 at 9:00am on the topic of Fleet Management via Process Control Software. Review the rest of the conference program on the SIL website.

IWLPC

November 7-8 2012
Double Tree Hotel, San Jose, CA

Rudolph will exhibit at the International Wafer-Level Packaging Conference this fall.