Yield Forum Series
The Rudolph Yield Forum™ is a technology and applications seminar for semiconductor manufacturing professionals—fab managers, tool owners and process engineers. Launched in 2006, Yield Forums have been held in all major semiconductor manufacturing regions around the world. A typical agenda might include sessions for front-end wafer processing, back-end final manufacturing, probe card test and analysis and LED manufacturing. Speakers from top fabs join Rudolph applications experts to discuss industry trends and share current application data and results from ongoing tool evaluations and production processes at various fabs.
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2013 Yield Forum Schedule
7 May - Hsinchu, Taiwan
6 December - Tokyo, Japan
10 December - Seoul, Korea
2012 Yield Forums
24 April – Shanghai, China
26 April – Beijing, China
8 May – Hsinchu, Taiwan
18 September – Regensburg, Germany
13 December – Singapore
October 1 - 3, 2013
Rosen Centre Hotel, Orlando, Florida
Join Rudolph at IMAPS 46th International Symposium on Microelectronics this fall to learn more about Rudolph’s product suite for the demanding requirements of the advanced packaging market, including 2D/3D bump inspection, RDL and overlay metrology, and a lithography stepper specifically designed for the back-end. Turn data into useful information with Rudolph’s proprietary software solutions including run-to-run control, fault detection and classification and yield management systems.
Join our experts for the following speeches:
Inspection and Metrology Solutions for Cu Pillar & TSV High Volume Manufacturing
Bringing Front-end Process Requirements into the Back-end
Improved Compensation for a Reduction Stepper to Meet Challenges for Advanced Packaging Applications
September 4 - 6, 2013
Rudolph looks forward to exhibiting in the new TWTC Nangang Exhibition Hall at Semicon Taiwan. Plan to stop in booth 508 and talk to one of our experts regarding your application needs. We look forward to meeting you.
IEEE Electronic Components and Technology Conference
May 29 - 30, 2013
Booth 8 in Chelsea Commons area
Cosmopolitan Hotel, Las Vegas, NV
Heading to ECTC this spring? Stop by the Rudolph exhibit to speak with our experts about new advanced packaging inspection. lithography, metrology and software solutions. Learn more about Rudolph’s product suite for the demanding requirements of the advanced packaging market, including 2D/3D bump inspection, RDL and overlay metrology, and a lithography stepper specifically designed for the back-end. Turn data into useful information with Rudolph’s proprietary software solutions including run-to-run control, fault detection and classification and yield management systems.
Strategies in Light
February 12-14, 2013
Santa Clara Convention Center
Visit the Rudolph exhibit at SIL 2013 to learn about the manufacturing software making a difference to LED manufacturers—a suite of advanced analysis and control software systems that are designed to maximize ROI, allowing LED manufacturers to gain market share through lower ASP, increase profits through R&D investments, and enable new markets.
Matthew Chriss will present during the Manufacturing Track on Thursday, February 14 at 9:00am on the topic of Fleet Management via Process Control Software. Review the rest of the conference program on the SIL website.
November 7-8 2012
Double Tree Hotel, San Jose, CA
Rudolph will exhibit at the International Wafer-Level Packaging Conference this fall.